0eC’s technology solves many of the challenges associated with the constant increase in performance needed for packaged applications (i.e. si interposers for 2.5D and 3D IC applications) for many years to come.
This will be the first application of our technology, disrupting a billion dollar industry with a single stroke.
Most semiconductor devices today are enclosed in packages such as 2.5 D interposers or 3D IC.
Since mega trends such as the Internet of Things (IoT) and connected and self-driving cars will necessitate higher bandwidth data processing and communications, the need for high-performance packages will increase exponentially.
But the industry faces several big challenges as current technologies struggle to handle the increase in data, resulting in data bottlenecks, increased energy consumption and physical limitations in die size.
Not an evolution.
A game changer.
0eC’s first product will solve both current and future data bottlenecks for 2.5D packages and will save the semiconductor industry billions of dollars in research and development, as they will no longer need to constantly look for new ways to improve current but insufficient technologies.
Our game-changing technology will replace interposers in packaged applications with a smarter, faster, and much more efficient design, which will allow our customers to concentrate on chip design rather than on the connections between the chips.